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UBA2024
Half-bridge power IC for CFL lamps
Rev. 03 -- 16 October 2008 Product data sheet
1. General description
The UBA2024P is a high-voltage monolithic integrated circuit. The Integrated Circuit (IC) is designed for driving Compact Fluorescent Lamps (CFL) in a half-bridge configuration. The IC features a soft start function, an adjustable internal oscillator and an internal drive function with a high-voltage level shifter for driving the half-bridge. To guarantee an accurate 50 % duty cycle, the oscillator signal is passed through a divider before being fed to the output drivers.
2. Features
I I I I I I I Integrated half-bridge power transistors Integrated bootstrap diode Integrated low-voltage supply Adjustable oscillator frequency Maximum voltage of 550 V Minimum glow time control Soft start
3. Applications
I Driver for any kind of load in a half-bridge configuration I Especially for electronically self-ballasted CFL for lamp currents up to 220 mA (RMS) under the restriction that the maximum junction temperature is not exceeded
4. Ordering information
Table 1. Ordering information Package Name UBA2024P DIP8 Description plastic dual in-line package; 8 leads (300 mil) Version SOT97-1 Type number
NXP Semiconductors
UBA2024
Half-bridge power IC for CFL lamps
5. Block diagram
6
UBA2024
VDD CONTROL VDD SW 7 HS 1 SWEEP AND GLOW TIME CONTROL VDD(stop) HIGH VOLTAGE LEVEL SHIFTER HIGH SIDE DRIVER 5 RC 8 OSCILLATOR DIVIDE-BY-2 DEAD TIME LOW SIDE DRIVER SGND 2 4
mdb029
HV
3
FS
OUT
LS
PGND
Fig 1.
Block diagram
6. Pinning information
6.1 Pinning
SW SGND FS PGND
1 2
8 7
RC VDD HV OUT
UBA2024P
3 4
014aaa657
6 5
Fig 2.
Pin configuration DIP8 package
6.2 Pin description
Table 2. Symbol SW SGND FS PGND OUT HV VDD RC Pin description Pin 1 2 3 4 5 6 7 8 Description sweep timing input signal ground high-side floating supply output power ground half-bridge output high-voltage supply internal low-voltage supply output internal oscillator input
UBA2024_3
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 -- 16 October 2008
2 of 12
NXP Semiconductors
UBA2024
Half-bridge power IC for CFL lamps
7. Functional description
7.1 Supply voltage
The UBA2024 is powered by a supply voltage applied to pin HV. The IC generates its own low supply voltage for the internal circuitry. Therefore an additional external low-voltage supply is not required.
7.2 Start-up state
With an increase of the supply voltage on pin HV, the IC enters the start-up state. In the start-up state the high-side power transistor is not conducting and the low-side power transistor is switched on. The internal circuit is reset and the capacitors on the bootstrap pin FS and low-voltage supply pin VDD are charged. Pins RC and SW are switched to ground. The start-up state is defined until VDD = VDD(start).
7.3 Sweep mode
The IC enters the sweep mode at the moment the voltage on pin VDD > VDD(start). The capacitor on pin SW is charged by Isweep and the half-bridge circuit starts oscillating. The circuit enters the start-up state again when the voltage on pin VDD < VDD(stop).
7.4 Reset
A DC reset circuit is incorporated in the high-side driver. The high-side transistor is switched off when the voltage on pin FS is below the high-side lockout voltage VFS(lock).
7.5 Oscillation
The oscillation is based upon the 555-timer function. With the external resistor ROSC and capacitor COSC (see Figure 3) a self oscillating circuit is made, where ROSC and COSC determine the oscillating frequency. To realize an accurate 50 % duty cycle, an internal divider is used. Due to the presence of the divider, the bridge frequency is half the oscillator frequency. The output voltage of the bridge will change at the falling edge of the signal on pin RC. The design equation for the half-bridge frequency is: 1 f osc = ----------------------------------------k x R OSC x C OSC An overview of the oscillator signal, internal LS and HS drive signals and the output is given in Figure 3.
UBA2024_3
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 -- 16 October 2008
3 of 12
NXP Semiconductors
UBA2024
Half-bridge power IC for CFL lamps
VRC 0 time
HS drive 0 time
LS drive 0 VOUT half bridge 0
time
time
014aaa658
Fig 3.
Oscillator, drivers and output signals
When entering the sweep mode, the oscillator starts at 2.5 times the nominal bridge frequency and sweeps down to the nominal bridge frequency fnom; see Figure 4. During this continuously decreasing of the frequency, the circuit approaches the resonance frequency of the load. This causes a high voltage across the load, which ignites the lamp. The sweep time tsweep is determined by the charge current Ich(sw) and the external capacitor CSW. The sweep to resonance time should be much larger than the settling time of the supply voltage on pin HV to guarantee that the full high-voltage is present at the moment of ignition. The amplitude of the RC oscillator is equal to the minimum value of VRC(h) and VSW + 0.4 x VRC(h). During the sweep time a current is flowing through the lamp electrodes for preheating the filaments.
UBA2024_3
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 -- 16 October 2008
4 of 12
NXP Semiconductors
UBA2024
Half-bridge power IC for CFL lamps
VHV
0 VDD VDD (start)
time
time VSW VDD 0.8 VRC(h)
0 fosc 2.5nom
time
nom 0 Vlamp Vign VgloA Vnom 0 tsweep
014aaa659
time minimum glow time control
time
Fig 4.
Start-up frequency behavior
7.6
Glow time control
The drawback of cold-started CFL lamps is its inherent glow time which reduces the switching lifetime of the electrodes (lamp). To make this glow phase as short as possible, the maximum power is given to the lamp during the glow time via a special control; see Figure 4.
7.7
Non-overlap time
The non-overlap time is defined as the time that both MOSFETs are not conducting. The non-overlap time is internally fixed.
UBA2024_3
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 -- 16 October 2008
5 of 12
NXP Semiconductors
UBA2024
Half-bridge power IC for CFL lamps
8. Limiting values
Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VHV Parameter Conditions mains transients during 0.5 s VFS VDD IDD floating supply voltage low-voltage output supply voltage low-voltage output supply current power ground voltage internal oscillator input voltage on pin RC sweep time input voltage on pin SW slew rate output on pin OUT junction temperature ambient temperature storage temperature electrostatic discharge voltage human body model: pins HV and VDD pins SW, RC, FS, and OUT machine model: pin FS pins HV, VDD, SW, RC, and OUT
[1] [2]
[2] [1]
Min VHV
Max 373 550 VHV + 14 14 5
Unit V V V V mA
high-voltage supply voltage normal operation
DC supply peak value is internally limited; Tamb = 25 C referenced to SGND Ii(RC) < 1 mA Ii(SW) < 1 mA repetitive
0 0
VPGND VI(RC) VI(SW) SR Tj Tamb Tstg Vesd
-1 0 0 -4 -40 -40 -55
+1 VDD VDD +4 +150 +150 +150
V V V V/ns C C C
-
1000 2500
V V
-
200 250
V V
In accordance with the Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. In accordance with the Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 1.5 k series resistor and a 0.75 H inductor.
UBA2024_3
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 -- 16 October 2008
6 of 12
NXP Semiconductors
UBA2024
Half-bridge power IC for CFL lamps
9. Thermal characteristics
Table 4. Symbol Rth(j-a) Rth(j-c)
[1]
Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to case Conditions in free air in free air
[1]
Typ
Unit 95 K/W 16 K/W
[1]
In accordance with IEC 60747-1
10. Characteristics
Table 5. Characteristics Tj = 25 C; all voltages are measured with respect to SGND; positive currents flow into the IC. Symbol VHV VFS VDD Parameter high-voltage supply voltage floating supply voltage low-voltage output supply voltage Conditions t < 0.5 s; IHV < 30 mA t < 0.5 s; IHV < 30 mA VHV = 100 V; ROSC = ; VSW = VDD; VRC = 0 V VHV = 100 V; ROSC = ; VSW = VDD; VRC = 0 V Min 0 0 11.7 Typ 12.5 Max 550 564 13.3 Unit V V V High-voltage supply
Low-voltage supply
Start-up state IHV high-voltage supply current 0.39 mA
VDD(start) VDD(stop) VDD(hys) RHS(on) RLS(on) VHS(d) VLS(d) IHS(sat)
start of oscillation voltage stop of oscillation voltage start-stop hysteresis voltage HS transistor on-resistance LS transistor on-resistance HS body diode forward voltage LS body diode forward voltage HS transistor saturation current VHV = 310 V; Id = 100 mA Id = 100 mA If = 200 mA If = 200 mA Vds = 30 V; Tj 125 C; VHV = 310 V Vds = 30 V; Tj 125 C RMS value If = 1 mA
10 8 2 1.4 1.2 900
11 8.5 2.5 9.7 8.5 1.8 1.6 -
12 9 3 11 9.4 2.2 2.0 -
V V V V V mA
Output stage
ILS(sat) IO(max) Vboot tno VFS(lock) IFS
LS transistor saturation current maximum output current bootstrap diode drop voltage non-overlap time floating supply lockout voltage floating supply current
900 0.7 1 3.6
1.0 1.35 4.2 14
220 1.3 1.7 4.8 18
mA mA V s V A
VHV = 310 V; VFS = 12.2 V
10
UBA2024_3
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 -- 16 October 2008
7 of 12
NXP Semiconductors
UBA2024
Half-bridge power IC for CFL lamps
Table 5. Characteristics ...continued Tj = 25 C; all voltages are measured with respect to SGND; positive currents flow into the IC. Symbol fosc fosc(nom) Parameter Conditions Min 40.05 Typ 41.32 Max 60 42.68 Unit kHz kHz Internal oscillator frequency range bridge oscillator VSW = VDD nominal frequency bridge oscillator bridge oscillator frequency variation with temperature high-level trip point factor high-level trip point voltage on pin RC low-level trip point factor low-level trip point voltage on pin VRC(l) = kl x VDD RC oscillator constant ROSC = 100 k; COSC = 220 pF VSW = 0 V CSW = 33 nF; VDD = 12.2 V VRC(h) = kh x VDD ROSC = 100 k; COSC = 220 pF; VSW = VDD ROSC = 100 k; COSC = 220 pF; T = -20 to +150 C
fosc(nom)
-
2
-
%
kh VRC(h) kl VRC(low) Kosc
0.382 4.58 0.030 0.367 1.065
0.395 4.94 0.033 0.413 1.1
0.408 5.29 0.036 0.458 1.35 V V V
Sweep function Ich(sw) tsweep charge current for sweep sweep time 215 0.28 280 0.35 345 0.45 nA s
11. Application information
1.8 mH LFILT RFUS D1 D2 CBUF 4.7 uF D3 D4 CHB1 47 nF CLA 1.5 nF CHB2 47 nF 3.1 mH LLA
max. 550 V 11 W/150 mA
CFS 10 nF
HV FS
6 3
1 7
SW VDD
ROSC 110 K
AC mains supply (230 V)
33
OUT
CDV 100 pF
5 8
RC
COSC 180 pF
CVDD 10 nF
CSW 33 nF
UBA2024P
4 2 SGND
PGND
mdb033
Fig 5.
Schematic of standard compact fluorescent lamp application using UBA2024P
UBA2024_3
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 -- 16 October 2008
8 of 12
NXP Semiconductors
UBA2024
Half-bridge power IC for CFL lamps
12. Package outline
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
D seating plane
ME
A2
A
L
A1
c Z e b1 wM (e 1) b2 5 MH
b 8
pin 1 index E
1
4
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001 JEITA SC-504-8 EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-13
Fig 6.
UBA2024_3
Package outline SOT97-1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 -- 16 October 2008
9 of 12
NXP Semiconductors
UBA2024
Half-bridge power IC for CFL lamps
13. Revision history
Table 6. Revision history Release date 20081016 Data sheet status Product data sheet Change notice Supersedes UBA2024_2 Document ID UBA2024_3 Modifications:
* *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Product data sheet Product data sheet UBA2024_1 -
UBA2024_2 UBA2024_1
040203 030813
UBA2024_3
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 -- 16 October 2008
10 of 12
NXP Semiconductors
UBA2024
Half-bridge power IC for CFL lamps
14. Legal information
14.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
14.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
UBA2024_3
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 03 -- 16 October 2008
11 of 12
NXP Semiconductors
UBA2024
Half-bridge power IC for CFL lamps
16. Contents
1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional description . . . . . . . . . . . . . . . . . . . 3 Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . 3 Start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Sweep mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Oscillation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Glow time control . . . . . . . . . . . . . . . . . . . . . . . 5 Non-overlap time . . . . . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 October 2008 Document identifier: UBA2024_3

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